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[Introduction]
[Facility] [Testing
Equipment] [Certificate]
[Application] [Customer]
Single Side Board
- After the attachment of the single - sided PI copper-clad
material on the circuit, another protection film is
applied to form the FPCB with the single layer of conductor.
Double Side Board - After
the attachment of the double-sided PI copper-clad material
on the circuit, another protection film is applied on
both sides to form the FPCB with the double layer of
conductor.
Single Side Pierced Board
- Pure copper foil is applied to the circuit processing;
then a protection file is applied on both sides successively
to form a circuit with one layer conductor but with
conductor exposing on both sides of the circuit board.
Double Side Pierced Board
- Apply a piece of cohesive with specific locations
for window opening to the midst of a double-layer single
side PI copper-clad material, and then press it to form
a board partially pressed; the double-side conductor
FPCB with separate structure on partial areas brings
high flexibility quality to the FPCB.
Multi Layers Board - Apply
single-sided PI copper-clad material and cohesive as
the backing materials; introduce the similar technique
for processing backing boards to form double-sided boards,
and through multiple pressing to form a FPCB with multi-layer
structure. Partially layer structure can be designed
for providing high flexibility of the FPCB.
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